Semiconductor Industry

Confovis measurement systems integrate into the production process for the optical quality control of semiconductors and wafers. In particular: defect analyses, shape and contour measurements, TSV analyses, verification of microstructures and critical dimensioning.

Messung von verschiedensten Materialkombinationen und artefaktfrei an steilen Flanken

Rather than time-consuming point-by-point scans, it allows fast surface scans with utmost precision in measurement down to the sub-µ range. Using the ConfoVIZ® software, measurement data are generated within seconds, displayed in 3D and finally comprehensively analysed using MountainsMap® software.
In comparison to usual random sampling, it is possible to check all chips on a semiconductor wafer. Users can see at a glance whether the height of the contact holes or the width of conductors is within the tolerances on all chips and where there are any deviations. Due to the high number of measurements, the results are also statistically significant.

Messaufgabe 3D: Stufenhöhe

Messaufgabe 3D: Rauheit (Bondpads oder abgeschiedene Schichten)

Typical Applications:

Wafer Bumps
Needle Tip Analysis (Wafer Testing)
Needle Imprint (Wafer-Testing)
Wafer Micro Structures

Rezepte ohne Programmieren

Durch die intuitive Bedienung der ConfoViz© Software entfällt das Erlernen von komplizierten Skriptsprachen zum Erzeugen von Rezepten. Der Ablauf ist dabei denkbar einfach.

Zunächst wird ein Serien-Wafer vom Nutzer ausgewählt und angelernt. Hierbei werden Parameter, wie Dicke, Durchmesser, Flat/Notch nach Semi-Standard ausgewählt. Anschließend werden die Positionen für das Fein-Alignment des Wafers gesetzt. Es können dabei beliebige Alignmentmarken verwendet werden. Zudem ist es möglich Wafer, die noch keine Strukturen enthalten, zu alignen, um diese z.B. auch mit KLA-Dateien verwenden zu können.

Ist das Alignment abgeschlossen und sind die Koordinaten vom Messsystem transformiert, wird das Layout des Wafers angelernt oder geladen. Hierbei werden unterschiedliche Layout-Formate unterstützt, wie z.B. GDSII. Liegt kein Layout-File vor, wird der DIE-Pitch angelernt. Hierfür wird in 3 Schritten die Diagonale der DIEs gemessen. Das angelernte Layout wird nun zur einfachen Navigation und Rezept-Erstellung verwendet.

Pattern recognition

The ConfoVIZ© measurement and analysis software allows for automatic pattern recognition as well as the measurement of vias, slots, overlays and other surface characteristics. In addition, the software also supports wafer map analysis which can be used to automatically measure dies on a wafer. Reproducibility and independence of the measurement results from the user can be achieved thanks to the automatic measurement algorithms. You can see at a glance whether process-related parameters on the relevant dies are within the tolerances. The results are statistically signifi cant thanks to the high number of measurements.

Automated measurements for reliable measurement processes

Operating the ConfoViz© software is intuitive, measuring with the ConfoViz© software can be pre-programmed and proceeds quickly. The user can position the measurement device close to recurring structures on a base substrate level, set the area to be measured and save this as a measurement plan. All parameters such as lighting periods, etc. are adopted by the system automatically and stored under the product number. For a repeat measurement, an untrained operator can call up a previously stored measurement plan and the measurements are repeated automatically. This results in the following advantages:

  1. Qualified personnel with metrological knowledge is only required to configure the measurement and evaluation once; after that, the company can carry out its own inspections.
  2. Follow-up measurements and evaluations are performed without any influence from the operator.
  3. Time-consuming programming of measurement plans becomes unnecessary.
  4. Downtime on production machines are reduced thanks to the high measurement speed.
  5. Because two measurement techniques are united in one device, only one operating interface must be instructed.

Characteristics tests made easy

Evaluations are completed in the MountainsMap® software after the measurement data are exported. Relevant surface characteristics such as circles, cylinders, elongated holes, webs or levels can be examined both by position and dimension and by spacing and angles. Furthermore, these can also be compared with each other as well as to the CAD reference — including form and position tolerance measurements. Formatted reports with individual report templates can be created and the measurement results exported into Excel or Word. It is also possible to output the entire measurement report as a PDF.

To arrange the data in a way that is more straightforward, the tolerance utilisation on test items is classified and depicted using a traffic light approach. This way, it is obvious whether items are within the tolerances and/or within the control limits or should be discarded at a glance. For industrial applications in which other evaluation tools are to be used as well, the ConfoViz© software provides diverse output formats such as PIF, G3D, STL and ASCII to name a few. With these, customers can continue to use the evaluation tools they are trained to use and have used before. Watch the video on the right to see the measurement system in action. >>