Wafer Inspection
- Defect Inspection & Integrated Metrology: AOI and metrology combined in a single platform, enabling sub-micron resolution defect detection with high-speed comprehensive 2D/3D measurements.
- Patented Confocal Measurement Technology: Structured Illumination Microscopy (SIM) delivers exceptional precision and speed in metrology, ensuring accurate measurements across various materials and structures.
- Customizable & User-Friendly Design: Confovis' user-centric design reduces setup time and minimizes the need for extensive training, streamlining the inspection workflow and enabling for rapid adaptation to new requirements.
confovis · Applications ·
Wafer inspection is a critical step in semiconductor manufacturing, ensuring that wafers meet stringent quality standards before advancing to subsequent production stages. By identifying defects early, wafer inspection safeguards yield, reduces waste, and guarantees the performance and reliability of semiconductor devices.
Confovis offers state-of-the-art solutions for semiconductor inspection, using advanced techniques such as:
- 1. Automated Optical Inspection (AOI): AI identifies even the smallest defects that conventional methods might miss.
- 2. 3D Defect Inspection: A next-generation approach for analyzing volumetric defects and surface topology with sub-micron accuracy.
You are currently viewing a placeholder content from Vimeo. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationConfovis offers the next generation of wafer inspection. Our advanced technologies combine accuracy, stability and efficiency:
Confovis WAFERinspect systems use a single beam path for both defect inspection and metrology. This ensures unmatched consistency, eliminating discrepancies between imaging and measurement. It is ideal for tasks like overlay metrology and on-the-fly inspection.
SIM technology provides sub-micron precision for defect detection and metrology across a wide range of semiconductor materials and substrates.
Our dual-sensor systems combine high-resolution 2D imaging with 3D surface profiling for comprehensive defect detection and metrology in a single workflow.
Integrated AI algorithms improve defect detection accuracy, adapt to changing defect patterns, and reduce false positives for streamlined process control.
Real-time processing and continuous path motion control ensure measurement stability and significantly increase throughput, even on multi-layer surfaces.
Confovis tools adapt to manual, semi-automated, or fully automated workflows. Multisensor upgrades ensure that your systems evolve with your production need.
Confovis integrates Artificial Intelligence (AI) into its WAFERinspect systems, combining high-resolution imaging with intelligent defect analysis to address the challenges of modern semiconductor manufacturing.
Key Benefits of AI in Wafer Inspection:
- Improved Detection Accuracy: AI identifies even the smallest defects that conventional methods might miss.
- Adaptive Learning: Continuously evolves by analyzing new defect data, ensuring adaptability to changing manufacturing conditions (unsupervised learning).
- Enhanced Classification: Distinguishes critical defects from non-critical defects, reducing false positives and streamlining process control.
- Faster Processing: Automates defect analysis for high-throughput manufacturing without sacrificing quality.
Confovis specializes in delivering robust wafer inspection solutions that combine precision and efficiency:
- High-Resolution Imaging: Advanced sensors for detecting the smallest defects.
- Dual-Sensor Technology: Simultaneous 2D and 3D inspection for complete coverage.
- Multisensor Upgrades: Add capabilities as your production demands grow.
- Flexible Configurations: Tailored systems for any inspection environment.
Wafer inspection supports quality control across a wide range of semiconductor applications, including:
- Photonic Integrated Circuits (PICs): Ensuring alignment and quality of the functional relevant features.
- MEMS Sensors and Actuators: Detecting structural defects and anomalies.
- Power Semiconductors: Verifying surface integrity and structural soundness.
- 3DICs & Advanced Packaging: Ensuring the accuracy of wafer-level packaging processes.
As semiconductor technologies advance, there is an increasing need for precise and reliable semiconductor defect inspection solutions. Confovis is at the forefront of this innovation, offering systems that can achieve unparalleled precision and reliability in wafer inspection.
Our solutions are designed to meet the challenges of modern manufacturing with unmatched accuracy and efficiency in areas such as Photonics, MEMS, 3DIC, and Advanced Packaging.
Confovis does not just stop at wafer inspection. To achieve comprehensive wafer analysis, wafer metrology plays a crucial role in evaluating dimensional and structural properties. By integrating wafer inspection and metrology, fabs can gain a complete understanding of wafer quality, from defect detection to precise measurements.
Choose Confovis to explore the future of wafer processing with innovative, scalable, and reliable solutions tailored to your needs.
Our wafer inspection tools seamlessly integrate into your existing workflows, offering high-speed, high-precision detection of surface and structural defects. Supporting both 2D and 3D wafer defect inspection, our solutions address the complexities of modern applications, from photonics to advanced packaging.
Confovis WAFERinspect systems can be upgraded with multisensor capabilities to provide comprehensive quality control tailored to your needs.
With Confovis, you gain more than just inspection tools. You gain a trusted partner committed to improving yield, enhancing product quality, and driving innovation.
Discover how our WAFERinspect systems can optimize your wafer inspection processes, minimize waste, and guarantee that your products meet the highest standards in semiconductor manufacturing.
ARE YOU LOOKING FOR A SOLUTION FOR YOUR APPLICATION?
CONTACT US!
