- High-Resolution Optical Imaging for sub-micron defect detection.
- AI-Powered Defect Analysis for improved accuracy with minimal false positives.
- Confocal Technology for measuring 3D structures in any combination of materials with unmatched precision and display of 3D point clouds and intensity data.
As semiconductor technologies advance, inspection accuracy and reliability are critical to managing the growing complexity of modern production. Confovis automated optical inspection (AOI) solutions deliver unmatched defect detection, optimizing yield and driving innovation in applications such as advanced packaging, 3D ICs and emerging materials.
With high-speed, sub-micron resolution, our systems provide efficient process control and accurate defect classification on both structured and unstructured wafers, to meet the rigorous demands of advanced semiconductor manufacturing. Discover how Confovis enables manufacturers to stay ahead in a rapidly evolving industry.
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More InformationDesigned for the most demanding semiconductor applications, Confovis systems offer a comprehensive solution that meets industry-leading standards.
- Intuitive Interface: An easy-to-use graphical user interface (GUI) simplifies operations and minimizes training requirements, for faster implementation.
- Dual Sensor Technology: Confovis DUAL AOI enable 3D and 2D defect inspection in one system.
- Flexible Light Frequencies: Multi-wavelength imaging enables precise defect identification across a wide range of materials and layer thicknesses, making the system versatile for multiple applications.
AOI is implemented in semiconductor manufacturing as a critical quality control step at various stages of the production process. It helps identify defects, ensure process consistency, and optimize yield to remain competitive in a rapidly evolving industry.
Here is how AOI is typically implemented:
- AOI is used to inspect bare wafers with epitaxial layers, Nitride or Oxide layers for particles, scratches, and crystal defects before further processing.
- This prevents defective materials from entering critical stages like lithography, which could propagate errors.
- After lithography and etching, AOI checks for defects such as misaligned patterns, line width variations, and missing features.
- High-resolution imaging and pattern recognition are employed for die-to-die or die-to-Golden Sample comparison.
- AOI inspects redistribution layers (RDLs), bumps, and underfills in flip-chip or fan-out wafer-level packaging.
- It ensures interconnects are free of defects and meet the required specifications for electrical conductivity.
- AOI examines diced wafers and individual dies for chipping, scratches, or surface irregularities.
- Inspection of TSVs in 3DICs is critical to ensure proper vertical interconnects.
- Ensures accurate placement and integrity of solder balls on packages to prevent electrical connection failures.
- Dual-sensor or multispectral AOI systems are often employed for reflective and challenging surfaces.
- AOI verifies the quality of the chips embedded in the housing and controls the positioning of the housing.
With Artificial Intelligence (AI) at the core of Confovis’ AOI systems, manufacturers gain a smarter, faster, and more reliable approach to AOI for wafers. By reducing manual intervention, improving defect detection rates, and providing actionable insights, Confovis enables semiconductor production lines to achieve higher quality, less waste, and greater efficiency.
Can differentiate between cosmetic and killing defects, improving decision-making for process optimization.
With advanced algorithms, AI identifies, localizes, and defines the boundaries of defects.
AI can identify and separate areas of interest, such as defects, surface structures, or critical design elements, from the surrounding regions.
Identifies irregularities or unexpected patterns that deviate from the learned norm. Leveraging unsupervied learning, AI can detect anomalies without prior labeling or pre-defined defect classes.
AI can detect even the smallest defects that traditional methods might miss.
AI categorizes defects into groups, enabling you to focus on resolving the most impactful issues efficiently.
Automated defect analysis significantly reduces inspection time, resulting in faster production without sacrificing quality.
Through continuous data analysis, Confovis systems can evolve and adapt to new and changing defect patterns, ensuring flexibility in highly variable environments.
Comprehensive die inspection is critical in safety-critical semiconductor applications for industries such as autonomous driving, aerospace and medical devices. These sectors require full inspection of each die, rather than random sampling, to meet the stringent safety and reliability standards required for mission-critical components.
The deployment of 5G technology relies on specialized semiconductor materials such as advanced ceramics, glass, and compound semiconductors (e.g., GaN, SiC). These transparent or semi-transparent materials require nanometer-level vertical measurement accuracy, a challenge that Confovis AOI systems excel at, ensuring flawless inspection for high-performance devices.
Confovis AOI and metrology solutions deliver fast, accurate and reliable inspections, making them essential for maintaining quality and safety in these critical semiconductor manufacturing applications.
Confovis AOI systems enable manufacturers to meet the demands of modern semiconductor processing with precision, speed and adaptability. Discover how our solutions can improve your quality assurance processes and drive innovation in your manufacturing workflow.
At Confovis, we deliver state-of-the-art AOI solutions tailored to the demands of advanced semiconductor manufacturing. With precise 2D imaging, 3D analysis, and intelligent software, our tools ensure superior defect detection and comprehensive quality control across applications like photonic integrated circuits, advanced packaging, and inspection of diced wafers.
Scalable and flexible, our solutions integrate metrology and multisensor capabilities to optimize your production processes. Partner with Confovis to reduce inspection costs, improve defect detection, and increase efficiency.
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