Wafer Metrology
- Accurate & reliable wafer metrology using confocal technology ensures high-resolution, artifact-free measurements for tight process control and optimal device performance.
- Seamless integration into existing fab environments to minimize downtime and to accelerate the implementation of advanced metrology capabilities.
- Flexibility & versatility to accommodate diverse wafer sizes, materials, and design enabling rapid adaptation to new processes and technologies.
confovis · Applications ·
Wafer metrology plays a critical role in ensuring the accuracy and quality of semiconductor manufacturing. Confovis has developed a unique approach to wafer metrology by combining Structured Illumination Microscopy (SIM) and Focus Variation (FV) to provide unparalleled accuracy in 2D and 3D wafer measurements. This combined technology enables the simultaneous acquisition of fine lateral details and precise vertical information.
With a focus on improving yield and process control, Confovis’ wafer metrology systems offer comprehensive solutions where a single tool provides both 2D and 3D measurements, reducing the need for multiple tools and simplifying process control.
Each system is designed for seamless integration and offers unparalleled flexibility and versatility in handling different wafer sizes and materials. Ideal for industries such as photonics, MEMS, power semiconductors, 3DIC, and advanced packaging.
By using a structured pattern of light, SIM goes beyond the traditional diffraction limitations of optical microscopy to produce high-resolution images, allowing better control of critical dimensions (CD) and overlays.
FV measures vertical features by analyzing the focal plane of different areas across the wafer. This enables accurate topography and depth measurements, particularly for rough surfaces and 90° slopes. SIM offers single nanometer resolution on transparent and high reflective surfaces.
Both SIM and FV are non-contact wafer metrology methods that ensure the integrity of fragile semiconductor wafers and structures.
Combining SIM and FV allows fast 2D and 3D wafer measurements without sacrificing accuracy
Confovis’ WAFERinspect tools handle a wide range of materials and wafer sizes, making it adaptable to virtually any semiconductor process, including MEMS, power semiconductors, 3DIC, advanced packaging, and photonics.
The combined SIM and FV approach is particularly valuable for advanced semiconductor technologies where both lateral and vertical measurements are critical for process control.
Key applications of our semiconductor metrology solutions include:
- In Photonic Integrated Circuits (PICs), precise lateral dimensions of waveguides, gratings, and other structures are critical, while vertical measurements of etched features and surface profiles ensure optimal device performance.
- MEMS devices have complex topographies and multi-layer structures. Confovis' approach provides accurate characterization of topographies, surface roughness, and critical dimensions (CD) to ensure safe and reliable device performance.
- Advanced Packaging and 3DIC – With SIM's lateral resolution and FV's depth capabilities, Confovis' tools can accurately resolve critical features in redistribution layers (RDL), micro-bumps, and through-silicon vias (TSV).
- Power Semiconductors – Ensuring proper alignment and feature height is critical to the performance of power semiconductors. Confovis' combined approach provides the precision needed to inspect these parameters.
At Confovis, we provide cutting-edge wafer metrology systems tailored to your requirements, combining the latest confocal technology with precision and flexibility.
Our systems provide accurate measurements across a wide range of materials and designs, integrating easily into existing processes. Supporting both 2D and 3D metrology, our tools address the challenges of advanced semiconductor manufacturing.
All our wafer metrology systems can be enhanced with additional AOI and wafer inspection capabilities, as required.
With Confovis, you gain a partner committed to enhancing your process control, improving yield, and enabling innovation.
Discover how our AI-powered WAFERinspect AOI systems can optimize your production processes, enhance your product quality, and drive operational excellence for your organization.
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