Wafer Bump Inspection
- High-Resolution 3D Metrology & Inspection: Confovis’ technology achieves nanometer accuracy on micro-bumps down to 1 µm, setting new standards in TCB interconnect inspection with sub-0.5 µm defect resolution.
- Fast & Automated Inspection: Combining high-speed measurement and AI-driven defect classification, our solutions enable efficient, high-throughput production monitoring.
- Non-Destructive & Contact-Free Analysis: Confovis’ unique optical inspection provides 3D surface profiles with single-nanometer vertical resolution and high repeatability, without contacting or damaging sensitive wafer surfaces.
confovis · Applications ·
As semiconductor designs advance, micro-bumps, copper pillars, and solder bumps become increasingly complex. Shrinking pitches and taller copper pillars are driving stricter control of interconnect quality across 2.5D/3D packaging, CoWoS-class interposers, chiplets, and HBM3/4 stacks.
For thermo-compression bonding (TCB) and hybrid bonding ready flows, pre-bond coplanarity and volume uniformity are critical to yield. Confovis systems provide 3D optical metrology and automated inspection to detect height variations, deformations, and surface defects with unmatched precision.
Identifying height variations, missing bumps, and deformations at sub-micron precision.
Detecting oxidation, organic residues, and material inconsistencies.
Maintaining efficiency while inspecting hundreds of thousands of bumps per wafer.
Measuring bump height, coplanarity, and volume for uniform interconnect performance.
As semiconductor designs advance, micro-bumps, copper pillars, and solder bumps become increasingly complex. Shrinking pitches and taller copper pillars are driving stricter control of interconnect quality across 2.5D/3D packaging, CoWoS-class interposers, chiplets, and HBM3/4 stacks.
For thermo-compression bonding and hybrid-bond-ready flows, pre-bond coplanarity and volume uniformity are critical to yield. Confovis systems provide 3D optical metrology and automated inspection to detect height variations, deformations, and surface defects with unmatched precision.
Reliable wafer bonding flows depend on tight pre-bond coplanarity, bump volume uniformity, and clean surfaces. Confovis integrates AOI with 3D/2D metrology to qualify micro-bumps and Cu pillars with SnAg caps for TCB as well as solder bumps used in other process flows.
- 3D bump profiling with sub-micron resolution.
- Detection of height deviations, missing bumps, deformations, and surface contamination (oxidation/organic residues).
- Non-contact, high-throughput measurements on micro-bumps down to 1 µm.
- AI-driven defect classification for process control.
- Scalable platforms for manual, semi-automated, and fully automated workflows.
- High-resolution 3D metrology for accurate bump height and coplanarity analysis.
- AI-powered defect classification for distinguishing between cosmetic and killing defects.
- Fully automated inspection to meet the demands of high-volume manufacturing (HVM).
- Modular system configurations for flexible integration into production lines.
- Micro-Bump Quality Control for TCB
- Solder Bump Quality Control for TCB
- Flip-Chip
- Wafer-Level Packaging (WLP)
- Copper Pillars
- TSV Bumps
- Wafer-Level Chip-Scale Packaging (WLCSP)
Confovis offers state-of-the-art wafer bump inspection solutions designed to meet the stringent requirements of advanced packaging and 3D integration.
The WAFERinspect product line provides high-resolution optical metrology and automated inspection in a single optical beam path to ensure the quality and reliability of micro-bumps, solder bumps, and copper pillars. The WAFERinspect AOI system provides fast, in-line defect detection, with 2D and 3D metrology capabilities to achieve precise bump height and coplanarity measurements. In addition, the WAFERinspect DUAL system, with its dual-sensor configuration, provides high-speed and high-accuracy inspection, making it ideal for manufacturers who require both precision and efficiency in their production lines.
By integrating Confovis’ advanced inspection solutions, semiconductor manufacturers can achieve higher yield rates, improved reliability, and optimized production efficiency.
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