confovis GmbH is presenting the latest generation of automatic measuring systems for the industry at the international trade fair for semiconductor technology, “Semicon Europe”. The experts for 3D surface analysis will be exhibiting the new L300 wafer inspection system, which enables automatic wafer analysis which is easy to set up and very flexible. The system is suitable It is particularly suitable for research and development and quality assurance. The “Semicon Europe” takes place between 8th and 10th October 2013 in Dresden.
confovis will be demonstrating the performance of the new L300 measuring system for wafer inspection at the “Semicon Europe”. It allows surface parameters and critical dimensions of wafers up to 300mm to be measured and analysed three-dimensionally and without contact. Thanks to the innovative scan technology, the system allows precise positioning and state-of-the-art software provides the most accurate measurements. At the touch of a button, the MountainsMap analysis programme can easily display and examine 3D surfaces.
With innovative software for automated wafer inspection
The expanded measurement and analysis software AutoAIM of our partner Invitronic (www.invitronic.de) offers special features for the semiconductor industry, beyond classic measuring and analysis options. As well as the automatic recording and evaluation of classic and confocal microscope images, the software also controls the motorised tables of the microscopes. This enables automatic two-dimensional and three-dimensional pattern recognition to measure vias, slotted holes, overlays and other surface features. In addition, the software also supports the analysis of wafer maps, during which all chips on a wafer are automatically measured. Due to the intuitive creation of the measurement protocols, programming knowledge is not needed. Thanks to the automated measurement algorithms, the user is guaranteed reproducibility and independence of measurements. Another feature is the intelligent, software-based hardware protection. This warns the user automatically against actions, which could damage the lens or probe.
Significant results and extensive checks
With the automatic recording and evaluation of the L300 wafer inspection system with AutoAIM software, the user saves time and benefits from reliable measurements. In comparison to usual random sampling, it is possible to check all chips on a semiconductor wafer. Users can see at a glance whether the height of the contact holes or the width of conductors is within the tolerances on all chips and where there are any deviations. Due to the high number of measurements, the results are also statistically significant.
confovis GmbH together with its partner Invitronic will be presenting its products on Stand 1236 in Hall 1 at the “Semicon Europe” in Dresden between 8th and 10th October 2013.
