3DIC - three-dimensional integrated circuits
- Inline automated optical inspection (AOI) for early-stage contactless detection of defects to increase yield and reduce costs.
- High-resolution metrology for accurate measurement of critical dimensions (CD) and topographies to ensure superior product quality.
- Single scan for defect detection and 2D/3D metrology for faster wafer inspection to keep up with high manufacturing throughput.
confovis ·
3DIC (three-dimensional integrated circuit) is an advanced packaging technique used to stack multiple integrated circuits (IC) and to interconnect them vertically using, for instance, through-silicon vias (TSV) and micro-bumps.
3DIC represents a groundbreaking approach in the evolution of ICs beyond Moore’s Law. Stacking multiple layers of active electronic components to create a single, compact device offers many benefits over planar 2D circuits such as faster processing speeds, lower latency, reduced power consumption, and smaller footprint.
However, 3DIC is also facing unique challenges including thermal management in densely packed circuits, manufacturing complexity, and long-term reliability.
The complexity of 3DIC manufacturing necessitates advanced AOI and metrology solutions to ensure the highest quality and reliability.
In the rapidly advancing field of semiconductor manufacturing, 3DIC is a major innovation. The importance of three-dimensional integrated circuits lies in their potential to meet the growing demand for higher performance and more energy-efficient electronic devices. Key benefits include:
- Heterogeneous Integration: Different types of chips (e.g., logic, memory, sensors) can be integrated into a single package.
- Increased Density: More functionality can be packed into a smaller formfactor.
- Enhanced Performance: Reduced signal delay and higher data bandwidth.
- Lower Power Consumption: Shorter interconnects result in lower energy use.
The main technologies involved in 3DIC manufacturing are through-silicon vias (TSV), die stacking, die-to-wafer and wafer-to-wafer bonding. 3D advanced packaging solutions can be divided in 3D system in package (3D SiP) and 3D wafer level package (3D WLP).
AOI and optical metrology are paramount to ensure the quality and reliability of 3DIC. AOI systems use high-resolution cameras and artificial intelligence (AI) to inspect wafers for defects at various stages of the manufacturing process. The main characteristics of inspection and metrology systems for 3DIC are:
- High precision and accuracy in measuring critical dimensions (CD) and surface features, such as topography.
- Speed: Automated systems can inspect wafers much faster than manual methods, keeping up with the throughput demands of modern fabs.
- Reliability: AOI provides consistent and repeatable results, improving overall product quality.
Confovis leverages state-of-the-art technologies in defect inspection and AOI to deliver unparalleled precision and reliability for 3DIC optical inspection. Our multi sensor metrology solutions further enhance our capabilities, ensuring optimal performance and efficiency to measure structures like high density bumps for your 3DIC manufacturing processes.
Our WAFERinspect tool provides a variety of handling configurations covering all wafer types and sizes. The system can perform a full inspection of wafers and film-frames up to 350 mm within minutes.
During the wafer scan, the tool can acquire nanometer precise 3D confocal image stacks of pre-defined regions of interest as well as all defects and anomalies encountered. These information are then analysed for systematic pre-programmed metrology tasks or for further evaluation of features and defects at the surface or embedded within the layers.
In the dynamic and demanding field of 3DIC semiconductor manufacturing, ensuring the highest quality and performance of integrated circuits is paramount. Confovis stands out in the field of AOI and metrology for 3DIC due to our commitment to cutting-edge technology and exceptional service.
- High-power multi-frequency illumination to enhance the contrast of the structures under inspection
- Detection of sub-micron surface and embedded defects
- Highest throughput for 100% inspection
- Customization and versatility
Combining AOI with advanced metrology techniques creates a robust framework that enhances overall manufacturing quality.
Dimensional Measurement: High precision measurements of critical dimensions (CD) and surface features of each layer and component.
Material Integrity: Assessing the quality and consistency of materials used in manufacturing.
Process Control: Monitoring and controlling various stages of production to minimize variability and defects.
High precision and accuracy in detecting and classification of defects throughout the entire process from front-end to packaging.
Speed: Automated systems can inspect wafers much faster than manual methods, keeping up with the throughput demands of modern fabs.
Reliability: AOI provides consistent and repeatable results, improving overall product quality.
In the dynamic and demanding field of 3DIC semiconductor manufacturing, ensuring the highest quality and performance of integrated circuits is paramount. Confovis stands out in the field of AOI and metrology for 3D integrated circuitsdue to our commitment to cutting-edge technology and exceptional service.
Discover how our AI-powered WAFERinspect AOI systems can optimize your production processes, enhance your product quality, and drive operational excellence for your organization.
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