Photonics
- High Precision: AOI defect detection ensures high precision and quality of photonic integrated circuits (PIC).
- Cost Reduction: Lowered production costs and time by automating defect detection and classification to identify process excursions as early as possible.
- Increased Yield: Inspection solutions enhance yield rates and support scalable production of high-quality PICs.
confovis ·
Photonics, the science of manipulating and detecting photons, has revolutionized industries from telecommunications to healthcare. At the heart of this innovation are Photonic Integrated Circuits (PIC). Like electronic integrated circuits but using photons (light) instead of electrons, PICs integrate components like lasers, modulators, and detectors on a single chip. Typically made from materials like silicon (Si), indium phosphide (InP), or silicon nitride (SiN), these compact devices offer:
- Higher Speed & Bandwidth: PICs handle data faster than traditional electronic circuits by integrating multiple components onto a single chip.
- Power Efficiency: They consume less power, making them ideal for cutting-edge optical communication networks.
- Miniaturization: PICs enable the creation of smaller, more compact systems for advanced applications in telecommunications and sensing.
As industries increasingly rely on PICs, the demand for high-precision inspection and metrology tools to ensure their quality grows rapidly.
Defect inspection and metrology are critical to the successful manufacturing of PICs. Confovis advanced AOI systems ensure the quality, reliability, and performance of semiconductor devices used in integrated photonics applications.
By leveraging cutting-edge technologies, including high-resolution imaging and artificial intelligence, we can help you achieve high yields with reduced production costs and accelerate time-to-market for innovative photonics products.
- Fast, Automated Defect Detection: AI-powered systems perform reliable inspections, detecting even sub-microscopic anomalies.
- Comprehensive Metrology: Accurate measurements of critical dimensions (CD) and surface features ensure process optimization.
- Surface Inspection: Detect surface anomalies that can compromise performance or reliability.
At Confovis, we offer state-of-the-art AOI and metrology tools designed specifically for PIC inspection at wafer and device level. Thanks to our broad experience in the semiconductor industry, we have the expertise to support you in shortening your development time and achieving consistent products with high yield. Our WAFERinspect systems provide:
- Combined AOI and metrology on the same optical path for 100% inspection at wafer and chip level.
- Early-stage defect detection before incurring additional costs.
- Support and training for high levels of automation.
- Customization and versatility of tools and workflows.
The WAFERinspect systems exploit the high-resolution data acquired during the AOI scans for with advanced 2D and 3D metrology of all defects and anomalies.
High-Precision Measurements: Accurate dimensional analysis of critical structures like waveguides and couplers.
2D/3D Metrology: Simultaneous 2D and 3D measurements for comprehensive surface and dimensional inspection.
Scalability: Solutions designed for both R&D and large-scale production environments.
Defect Detection: AI-powered systems accurately detect even the smallest defects that can impact PIC performance.
Anomaly Identification: Catch defects early in the process to reduce rework, minimize costs, and improve overall yield.
Versatility: Customizable solutions tailored to your specific needs of different PIC manufacturing processes.
In the evolving world of Photonics, ensuring the highest quality and performance is essential. Confovis has the tools and expertise to help you optimise production, improve yield and drive operational excellence.
Contact us today to learn how our advanced AOI and metrology solutions can help you achieve superior product quality and efficiency in your photonic integrated circuit manufacturing.
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