YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexibel
- High level of automation
confovis · Industries ·
The transition to the 5G implementation has a strong influence on the landscape of the radio frequency technology (RF). At the same time, the importance of radio frequency technologies is more and more increasing as a result of the demands made by autonomous driving and the Internet of Things (IoT). In the field of mobile communication, 5G smartphones require an improved efficiency and a large bandwidth which results in an increased number of filters (up to three times the former number) with much smaller geometries.
These challenges require much more precise and in many cases 100% inspections as well as 3D measurements. The Confovis WAFERinspect AOI offers specific solutions for the inspection of demanding resonator structures and RF components for the serial production.
- High-precision 3D defect inspection by way of topography measurements
- Detection of small defects with high resolution
- Inspection of transparent wafers
- Detection and handling of bulk acoustic wave (BAW) filters and surface acoustic wave (SAW) filters also in the case of thinned and framed wafers
- Best-in-class confocal 3D sensor
- Inspection at several focus levels possible
- Most diverse analysis options, such as Golden Sample, Care Areas, image processing, classificators
- Multi-frequency illumination and differential contrast
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
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Full 3D defect and anomaly inspection for inline semiconductor manufacturing
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Optical high-resolution image-based defect inspection on compound semiconductors
DOWNLOAD CASE STUDY
- Independent of materials: silicon, epoxy, glass, chrome, resist, etc.
- Measurements of demanding surfaces without artifacts (no ‘bat wings)
- High speed: 60 confocal frames per second (250 mil. measuring points)
- Film Thickness / Layer Stack
- Topography
- Coplanarity
- Bumps
- Roughness
- Step Height
Critical Dimensions
- Line/Space
- VIAs
- Oblong holes
- Overlay
- Macro defects
- Micro defects
- Particle inspection
- Golden Sample
- Defect detection with AI (deep learning, anomaly detection)
- Feature-based defect classification with neural network
- KLARF Files
- Visual Inspection with Fine Alignment
- Operator mode (visual inspection)
- Color images
- Depth of field images
- Stitching
- Documentation through comment function
- Digital inking
The Confovis WAFERinspect AOI System integrates various inspection and measuring jobs in just one system. By combining automated optical inspection (AOI) with metrology, Confovis is able to offer solutions for the inspection of resonator structures and RF components.
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