Reliable 3D & 2D measurements for the semiconductor industry
Measurement of micro and macro lead in one measuring procedure
Analysis of various surfaces
Automatic defect detection and defect inspection
OEM module
The Confovis measuring method for roughness and micro contour measurements
An example for this is contacts (mostly gold) of a USB stick, which are embedded in insulation material (mostly plastic), which puts other 3D measuring systems to the test due to the different materials. With the optical 3D measuring systems from Confovis such difficult combinations of material and surface can be handled without the use of filters. The same applies to extremely hard layers (e.g., DLC coatings or amorphous carbon layers such as ta-C), which can be detected at every process step. Due to the frequently random distribution of the structural elements of these surfaces, the use of Confovis measuring systems supply higher parameter stability than tactile devices.
Whether in production, clean rooms, test laboratories or in research & development: the Confovis measurement systems are easy to integrate, simple to operate and provide measuring results with an accuracy down to the single-digit nanometer range even in harsh environments. Besides, measurements are made at high speed, which saves valuable time.
- No use of noise filters, complete transparency of raw data
- Measurement on reflecting, transparent and diffuse surfaces
- Roughness measurement traceable to any roughness standard
- Simple handling: 3 clicks for the measurement, 1 click for the evaluation
- Short measuring time: very much like a profile device
- Automation and QA database interfaces
Detailed surface measurements are not yet standard in measuring machines or inspection systems, so that roughness or waviness must be measured at no less than two different stations. This requires higher input and therefore longer measuring time.
Simple integration into coordinate measuring machines (CMM) is ensured by the robust design (no moving parts). This eliminates the need for transfer times and also ensures the uniformity of data transfer.
