The Confovis WAFERinspect is the next generation of metrology as well as automated optical inspection (AOI) for MEMS, Fan Out Packaging, Probe Mark Inspection, LED, bump inspection and metrology.
Core of the Confovis WAFERinspect is the ultra-precise and fast confocal 3D sensor. The patented Confovis measuring method (Structured Illumination Microscopy, SIM) is capable of measuring 3D surfaces with an accuracy of 3 nm and a repeatability < 2 nm (@ 3 sigma). These values have been demonstrated at a certified step height of 50 nm. Measuring a 5µ step height with an accuracy of < 10nm and a repeatability of < 20 nm @ 3 sigma gets accomplished.
The optical quality of the entire system leads also with applications such as defect inspection on structured surfaces with low contrast or 2D measurements (e.g. Line/Space) to results not seen with comparable tools before. Due to the modern architecture of hardware and software it is possible to inspect structured surfaces using the “Golden sample” method. The defect detection software from our partner Neurocheck, which includes classification tools and neuronal networks, has a variety of options for challenging surfaces.
of MEMS, 3D packaging (especially bumps), probe marks, LED, roughness, CIS (CMOS Image Sensor),…
Integration of other sensors makes the system upwards compatible
In combination with a wafer handling system (EFEM) all kind of wafers can get measured
Confovis offers a very quick confocal measuring system. As the measurement is area-based and made with non-polarized LED light, even difficult combinations of materials such as, for example, chromium on glass, can be measured with high precision. The patented confocal measuring method does not use moving parts in the optical beam path, which makes it maintenance-free and robust. By switching over the illumination, a grid structure is imaged in the sample and the differential contrast evaluated by CCD sensor.
Besides the option of a stand-alone system, the WAFERinpect is available additionally as a fully automated wafer handling system with a wafer loader (EFEM). The measuring system is available in different variations: