WAFERinspect

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The Confovis WAFERinspect measuring system is suitable for the detailed measurement of wafer microstructures in the semiconductor industry. The wafer microscope systems produce high-definition results and precise measurements down to the nanometer scale. The measurement system WAFERinspect combines confocal 3D-measurements, classical 2D-measurements and visual inspection, which allows the analysis of different process steps within the semiconductor production. With a measuring and working range of 200 or 300 mm the WAFERInspect measuring system has been designed for all wafer sizes from 2“ – 12“ (semi standard). For professional handling and perfect positioning, vacuum chucks are used in combination with micro-positioning stages. In this way, data regarding the surface details of wafers can be determined in development, testing or directly on the production floor.

Macro defects
Micro defects
Golden Sample
Artificial Intelligence
Neuronal networks

Critical Dimensions: Line/Space
VIAs
Oblong holes
Overlay
Cognex
Halcon

Independent of materials (silicon, epoxy, glass, chrome, resist, etc.)
Measurements of demanding surfaces without artifacts (no ‘bat wings’)
High speed due to a self-damping z-drive: 40 confocal frames per second (167,772,160 measuring points/s)

Operator mode (visual inspection)
Color images
Extended depth of focus images
Stitching
Documentation by commentary function
Digital inking
Visual inspection with fine alignment, KLARFF-files

High-precision measuring technique: confocal with high vertical resolution of < 3 nm (VDI 2655)
Detection and measurement of critical dimensions on line/space, via, oblong holes, etc.
Determination of the overlay (2D und 3D)
Combined measuring method: Confocal measuring equipment for 3D analysis of microstructures and steep flanks (e.g., at bonding wires with focus variation)
Measurements of different surface coats/materials, including also on reflecting and transparent layers; no time-consuming FIB analysis, e.g., for assessment of undercuts
High degree of automation: manual, semi-automatic or fully automatic measuring system, as needed
Wafer handling systems and wafer positioning systems available (flexible wafer sizes and types, frame handling, etc. possible; Confovis recommends handling systems from Mechatronic)
Functionality of a traditional microscope: e.g., visual inspection of wafers through the eyepieces

MEMS
Micro LED
Membran
Probe Cards
Bond Pads & Wire
RDL (Redistribution layer)
UBM
Glass Wafer

Confovis offers a very quick confocal measuring system. As the measurement is area-based and made with non-polarized LED light, even difficult combinations of materials such as, for example, chromium on glass, can be measured with high precision. The patented confocal measuring method does not use moving parts in the optical beam path, which makes it maintenance-free and robust. By switching over the illumination, a grid structure is imaged in the sample and the differential contrast evaluated by CCD sensor.

No programming: simple and quick according to recipe (“DIE-Select“)
3 steps to the wafer layout: teach any layout, even without a layout file
ConfoVIZ® WaferInspect: operator-independent 2D & 3D measurements of line/space, VIAs, pillars, overlay and many other surface features
Defect review: Loading wafer maps enables simple and detailed failure analysis
DIE based display of the measuring results: Detect deviations on the wafer at one glance
Operator mode: Select recipe and wafer → start → display results

Confovis compiles the measuring system according to the customer’s measuring task. A wide range of compatible components is available: from scanning modules and high-precision Nikon and Olympus objective lenses, powerful measuring and analysis software, to a multitude of handling, fixing and mounting devices.