The Confovis WAFERinspect measurement systems combine the advantages of defect detection and dimensional measurement. Macro and micro defects are detected and classified at high speed and dimensional measurements are performed. A wafer loader which can load various wafers (e.g., MEMS, glass, warped, TAIKO, frame, etc.), makes the system suitable even for the most demanding measuring tasks in automatic process control.
Wafer inspection - a question of strategy
Wafer inspection is implemented by various approaches. By detection of defects wafers in production can be sorted and assigned to a particular step in manufacturing.
To reduce the frequency of defects, process parameters are set by “trial and error“. Dimensional measurements help check and adjust the manufacturing process and evaluate it, for example, by critical dimensions (2D and 3D). The advantage is that process parameters are optimized and therefore output increases.
Furthermore, the manufacturing step can be stabilized in the system. A 100% check is not always an economical solution, particularly when – depending on the required resolution – very many dimensional measurements must be made. The process behavior across the entire wafer also decides on the necessity of 100% control.
- Macro defects
- Micro defects
- Golden Sample
- Artificial Intelligence
- Neuronal networks
- Critical Dimensions: Line/Space
- Oblong holes
Confocal 3D Measurements
- Independent of materials (silicon, epoxy, glass, chrome, resist, etc.)
- Measurements of demanding surfaces without artifacts (no ‘bat wings’)
- High speed due to a self-damping z-drive: 40 confocal frames per second (167,772,160 measuring points/s)
- Operator mode (visual inspection)
- Color images
- Extended depth of focus images
- Documentation by commentary function
- Digital inking
- Visual inspection with fine alignment, KLARFF-files