Wafer inspection with Confovis
The Confovis WAFERinspect measuring systems combine the advantages of defect detection and dimensional measurements. In this way, macro and micro-defects are detected and classified at high speeds, with dimensional measurements also being carried out at the same time. The use of a wafer loader that can load various types of wafers (e.g. MEMS, glass, warped, TAIKO, frame etc.) will facilitate the most demanding measurement tasks in the field of automated process control.