MEMS (micro-electro-mechanical systems) are combining a variety of technologies. Due to the new challenges for the connected world the number of MEMS needed for 5G, autonomous driving, Internet of Things, microfluidics and mobile devices will explode over the next years. MEMS are one of the mega trends for the industry. MEMS are produced on wafers with diverse materials ranging from silicon and glass to epoxy and metals. Thus, often they contain non-standard material combinations and are more challenging for process control tools.
Due to the ability of Confovis to measure 3D surfaces independent from the material the WAFERinspect measuring systems are the future process control and metrology tools.
Automated optical MEMS inspection
Measuring tasks - MEMS inspection system
Confocal 3D measurements
- Independent of materials: silicon, epoxy, glass, chrome, resist, etc.
- Measurements of demanding surfaces without artifacts (no ‘bat wings’)
- High speed: 60 confocal frames per second (250 mil. measuring points/s)
- Film Thickness / Layer Stack
- Step Height
- Oblong holes
- Macro defects
- Micro defects
- Particle Inspection
- Golden Sample
- Artificial Intelligence
- Neuronal networks
- Operator mode (visual inspection)
- Color images
- Extended depth of focus images
- Documentation by commentary function
- Digital inking
- Visual inspection with fine alignment, KLARFF-files
MEMS Metrology: reliable measurement of smaller MEMS structures
Defect inspection proves to be a challenge and is often cost-intensive on wafers with very different structures and a required resolution of less than 1µ. Thanks to using microscope optics, the optical measurement systems from Confovis are in a position to analyze defects on the entire wafer surface not only as a large image with shading correction, but also „die-by-die“. Cracks in deeper layers, as an example, can be detected in multi-layered structures by searching the 3D-image stack for defects in z-direction.
Confocal measurement: advantages of the Confovis measuring method
Measure any kind of surfaces and MEMS structures (e.g. gold and plastic)
Unfiltered data / no measurement artifacts
High and low reflectivity in one field of view
WAFERinspect – a process control instrument for the inspection of MEMS
Due to the integration of defect inspection in combination with the high-resolution metrology tool WAFERinspect defects and dimensional deviations can not only get detected, but once found get measured in nanometer scale. The communication with the host follows SECS/GEM. MEMS manufacturing processes require a variety of handling solutions. Our partner company Mechatronic is experienced in handling glass, thin and high warped wafers.