YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexibel
- High level of automation
WAFERinspect AOI multisensor measurements for highest metrology flexibility
At the core of the WAFERinspect AOI is the well-proven ConfoCam® scan head developed and patented by Confovis. The ConfoCam® scan head has 2 modes of operation, confocal and focus variation, allowing for resolutions close to those of AFM with scanning throughputs up to 1000 times faster.
The WAFERinspect AOI is a fully automated wafer inspection and metrology tool, configurable for a wide range of applications in the wafer foundry, using both standard and customized solutions.
Flexibility and versatility are key features when it comes to metrology for modern semiconductor foundries. The multisensor upgrade of the WAFERinspect AOI provides a modular approach to create a fully automated tool that can solve all the required measurement tasks. The ConfoCam® scan head 2-in-1 can be complemented with additional TTV, TSV and thin film sensors on the same Z axis.
The multisensor upgrades allow for the measurement of a wide variety of new products. Moreover, by using a hybrid metrology concept, it is possible to enhance the precision of measurements where a single sensor is not sufficient.
The measurement system of the WAFERinspect AOI is based on a granite stand. The whole surface of the 300mm XY stage on the granite is fully accessible to all the sensors in any of the configurations with one or two Z axes.
When it comes to automation, flexibility is key.
The robot handling unit can be configured for wafers up to 300 mm. It can be also configured for the handling of non-SEMI-standard wafers, such as highly warped wafers or thin wafers.
The EFEM features a dual arm robot with various end-effectors, two load ports including scanner and RFID reader, pre-aligner and, if needed, OCR (Optical Character Recognition) reader stations.
The WAFERinspect AOI is equipped with filter fan units (FFU) providing ISO class 3 clean room conditions within the tool.
The tool is run by the SEMI-compliant software. This software allows recipe-based measurement and data analysis of structured and unstructured wafers.
Suitable measurement and evaluation routines can be chosen for your measuring task from a variety of packages. For recurring structures, a layout wizard with a graphical user interface (GUI) can support the user in teaching the measuring positions. In addition, fine sample alignment via pattern recognition is available as an option.
This software provides comprehensive capabilities, from manual measurement on the tool to fully automated measurement with one-button operation and integration into production control systems, e.g. via a SECS/GEM interface.
Various measurement tasks using different sensors to run consecutively as a measurement sequence is easy to configure. This includes the execution of measurements, processing and analysis using intelligent algorithms, output and visualization of results in the form of reports and the export of results in various data formats.
METROLOGY UNIT
WAFER HANDLING UNIT
EFEM ENCLOSURE
SOFTWARE
For large wafers/substrates
(XY stage up to 350mm)
Fully SEMI standard compliant automated wafer level system
within an Equipment Front End Module (EFEM)
ARE YOU LOOKING FOR A SOLUTION FOR YOUR APPLICATION?
CONTACT US!
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00