- AI-assisted 3D defect and anomaly detection.
- High speed, high resolution, full wafer scan with a high numerical aperture.
- Designed for micro-lenses and bumps in LiDARs and Advanced Packaging solutions.
- Two high-end sensors mounted side by side on independent Z axes.
The WAFERinspect AOI Dual tool offers industry-leading precision and efficiency, transforming the way high-performance semiconductor inspections are conducted. Leveraging dual-sensor technology, this system not only meets but surpasses the demands of complex wafer layouts and critical inline applications.
The first sensor is a chromatic line sensor with 1200 points per line, which enables 3D full wafer scans at very high speed, up to 36000 lines per second. 300 mm wafers are typically scanned in 2 to 3 minutes.
This scan is then followed by high-resolution 3D defect inspection with the second sensor, the Confocam, which is the patented Confovis confocal column.
Our dual-sensor approach ensures a comprehensive inspection process, especially for complex wafer with 3D structures in advanced applications.
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More InformationParallel-mounted chromatic line and Confocam sensors for seamless 3D scans and high-resolution defect inspections.
Scans 300 mm wafers in 2-3 minutes with AI-enhanced defect detection.
Covers structures from 10 µm to several millimeters, accommodating varied wafer sizes and materials.
Enhances defect detection accuracy for better yield and reduced costs.
- Photonics - The dual sensors enable a two-path inspection approach, enabling fast and comprehensive wafer inspection and defect detection on multiple layers of photonic integrated circuits (PIC). This is essential when inspecting features such as lenses.
- MEMS - The flexibility of the WAFERinspect AOI Dual system allows it to detect subtle surface defects and structural anomalies in 3D MEMS devices. Its dual sensor setup enables both high-resolution component inspection and broader surface analysis in a single pass.
- 3D Integrated Circuits (3DIC) - The Dual system’s high-resolution inspection can handle the complexities of multi-layered 3DICs, identifying defects in micro-bumps, TSVs, and layer integrity without compromising inspection speed.
- Advanced Packaging - This system can perform inspections at different scales to ensure the accuracy of alignment, interconnects, and other critical aspects. Its ability to inspect a wide variety of package designs reduces the time and complexity of transitioning from one type of inspection to another.
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
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Full 3D defect and anomaly inspection for inline semiconductor manufacturing
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Optical high-resolution image-based defect inspection on compound semiconductors
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At Confovis, we are committed to the satisfaction of our customers. We work closely with them to develop customized solutions for application-oriented tools.
The WAFERinspect AOI Dual is such an example. It is an automated optical inspection system with two high-end sensors capable of performing fast 3D wafer scans for inline applications where cycle time is critical, followed by a comprehensive 3D defect inspection to improve yield and quality while reducing costs.
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