YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexible
- High level of automation
- A single system for various inspection tasks: automated optical inspection & metrology
- Flexibility: rapid adaptation of the system to new requirements in the field of defect inspection
- "Swiss Army knife": automated solutions for 2D and 3D measurements, SECS/GEM, various handling solutions for MEMS, glass, warped, thin or Taiko wafers
- High accuracy and repeatabilities when performing 2D and 3D measuring tasks
The Confovis WAFERinspect AOI system combines the most diverse inspection tasks involving structured and unstructured wafers in just one system. By combining automated optical inspection (AOI) and metrology the Confovis WAFERinspect AOI offers individual solutions for defect inspection and classification as well as for 3D and 2D measurements (wafer level metrology) for MEMS, advanced packaging, RDL, bumps etc.
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In the field of defect Inspection, the defects on the wafers will be detected and classified during the scanning by the golden sample method. The relevant classificator works feature-based as well as image-based by way of artificial intelligence and is trained by the user to determine the affiliation to the relevant class on the basis of the defect properties identified. Hence, this does not require any defect teaching before the actual scanning, since the system itself finds the deviations between the golden sample and the defect scan on its own.
Apart from the defect scan, the confocal measurement method Structured Illumination Microscopy, which has been patented by Confovis, makes it possible to perform surface scans with nanometer precision and independent of the material with 60 confocal frames/sec. The measurements are typically made within two seconds (120 measuring planes with a z-area of 20 µ and an accuracy of < 4nm), with the measurement result being independent of the material of the surface to be measured. Even the most difficult combinations of passivation layers and copper can be measured without any problems and prior knowledge.
The Wafer Inspect software from Confovis ensures simple handling for the user by combining easy with professional modes, thus offering a maximum of assessment flexibility by way of „geometry measurements“. Formulas can be created within less than five minutes. Defects will be detected and assessed with the fully integrated and adaptable software from our partner NeuroCheck.
- MEMS
- Micro LED
- 5G ceramic surfaces
- glass wafer
- sapphire
- RDL (redistribution layer)
- laser diodes
- epitaxial layers (GaN on SiC)
- UBM (under bump metallization)
- GaAs
- SiC
- Ge
- LiTaO3
- LiNBO3
- SOI
- GaN
- InP
- Macro defects
- Micro defects
- Particle Inspection
- Golden Sample
- Defect detection with AI (deep learning, anomaly detection)
- Feature-based defect classification with neural network
- Independent of materials (silicon, epoxy, glass, chrome, resist, etc.)
- Measurements of demanding surfaces without artifacts (no ‘bat wings’)
- High speed: 60 confocal frames per second (251 million measuring points per second)
Critical Dimensions
- Line/Space
- VIAs
- Oblong holes
- Overlay
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
DOWNLOAD WHITEPAPER
Full 3D defect and anomaly inspection for inline semiconductor manufacturing
DOWNLOAD WHITEPAPER
Optical high-resolution image-based defect inspection on compound semiconductors
DOWNLOAD CASE STUDY
- Defect inspection and review in one tool
- Flexibility in the field of defect inspection: The inspection can be speedily adapted to any new tasks by way of artificial intelligence
- No defect teaching required before the actual defect scanning process
- Comprehensive 2D and 3D measurements of the most diverse structures (such as roughness, step heights, slopes, bumps, saw cuts, flatness, coplanarity, TSVs,…) and surfaces (silicon, epoxy, glass, chromium, …)
- Very high accuracy and repeatability
- Wafers ranging between 2 and 12 inches (SEMI, JEIDA, non-standard…)
- Substrate handling: wafers, frame, warped, thin, waffle pack, porous
- Handling options for highly warped wafers and Taiko handling options
- Flexible platform for further sensor integration
- Online und offline review capability
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