- Comprehensive Inspection Capabilities: Seamlessly combines defect detection with 2D and 3D metrology.
- Flexibility: Rapid recipe creation to meet evolving defect inspection and metrology requirements.
- High Precision: Ensures accurate and repeatable 2D and 3D measurements.
The WAFERinspect AOI tool has been designed to meet the rigorous demands of modern semiconductor manufacturing by integrating defect detection and metrology.
Its advanced technology not only ensures precise and repeatable measurements, but also enables easy adaptation to evolving inspection requirements, making it a valuable tool for quality assurance in wafer fabs.
Whether inspecting Photonic Integrated Circuits, MEMS, 3DICs, or Advanced Packaging products, the WAFERinspect AOI delivers robust results, that enable manufacturers to achieve higher yields and superior quality.
Merges automated optical inspection (AOI) with metrology for comprehensive wafer analysis.
Quickly adjusts to new defect inspection demands, accommodating various wafer types, including glass, warped, thin, and Taiko wafers.
Patented Structured Illumination Microscopy (SIM) provides nanometer-precision surface scanning at 60 confocal frames per second, independent of material type. This capability makes it possible to accurately measure complex surface combinations, such as passivation layers and metals, without detailed knowledge of the materials.
Utilizing the golden sample method, the WAFERinspect AOI system detects and classifies defects during scanning. Alternatively, also anomaly detection is an option. The classifier employs both feature-based and image-based artificial intelligence, allowing users to train the system to categorize defects based on identified properties. This approach eliminates the need for pre-scan defect teaching, as the system autonomously identifies deviations from the golden sample.
Delivers precise and repeatable 2D and 3D measurements, ensuring reliable results.
The intuitive software interface enables both novice and expert users to perform quick and accurate inspections. Automated workflows and AI-based defect classification further enhance productivity.
- MEMS – The WAFERinspect AOI system is tailored for inspecting the intricate structures of MEMS sensors and actuators. It identifies micro-defects, surface irregularities, and dimensional variations with high precision, ensuring the inspected chips perform reliably in automotive, medical, and consumer electronics applications.
- Advanced Packaging – Advanced Packaging solutions, including Fan-Out Wafer-Level Packaging (FO-WLP) and 2.5D/3D IC integration, require stringent quality checks. The WAFERinspect AOI system inspects redistribution layers, micro-bumps, and through-silicon vias (TSV) with high precision, ensuring high-quality interconnects for applications demanding higher performance and miniaturization.
- Redistribution Layers – The WAFERinspect AOI system excels at inspecting redistribution layers (RDL) for critical defects such as misalignments, cracks, and voids, ensuring the integrity of these critical structures for efficient signal transmission in advanced packaging solutions.
- Bump Inspection – With its 3D inspection and measurement capabilities, the WAFERinspect AOI system ensures precise evaluation of solder bumps and micro-bumps for defects like missing bumps, non-wets, or bridging.
- Photonics – Photonics devices, such as photonic integrated circuits (PICs) and optical waveguides, require exceptionally clean and defect-free surfaces to ensure optimal performance in light transmission and manipulation. The WAFERinspect AOI system detects particulate contamination, scratches, and structural defects with nanometer-level precision, ensuring defect-free components for optical communication, sensing, and laser applications.
- Transparent Wafers – Inspection of transparent materials, such as glass or sapphire wafers, poses unique challenges due to their optical properties. The WAFERinspect AOI system’s advanced optical capabilities enable accurate defect detection and metrology for transparent wafers, addressing needs in MEMS, photonics, and advanced packaging applications.
- Through-Glass Vias – Through-glass vias (TGV) are critical for interconnectivity in glass-based substrates, often used in photonics and advanced packaging. The WAFERinspect AOI system inspects TGVs for defects such as cracks, voids, or shape irregularities, ensuring the high reliability and performance required for these innovative technologies.
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
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Full 3D defect and anomaly inspection for inline semiconductor manufacturing
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Optical high-resolution image-based defect inspection on compound semiconductors
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The Confovis WAFERinspect AOI tool stands out as a cutting-edge solution for semiconductor inspection and metrology.
By integrating defect detection and precise 2D and 3D measurements, the WAFERinspect AOI system eliminates the need for multiple tools, reducing complexity and cost. The system can be quickly adapted to evolving requirements, making it suitable for a wide range of use cases.
The ability to upgrade with multisensor capabilities ensures that the WAFERinspect AOI system can evolve with your needs and provide a long-term return on your investment.
Backed by Confovis’s experience and commitment to innovation, the WAFERinspect AOI has been trusted by leading manufacturers in the semiconductor industry.
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