Skip to content
Confovis
Home
Products
AOI systems
WAFERinspect AOI
WAFERinspect AOI Dual
Multisensor Upgrade
Measurement systems
WAFERinspect
TOOLinspect
LEADinspect
Solutions
Advanced Packaging
Wafer Bump Inspection
MEMS
Semiconductors
AOI – Automated optical inspection
Compound semiconductors
Defect inspection & classification
Power semiconductors
RF – radio frequency technologies
Wafer inspection
Surface metrology
Roughness measurement
Lead analysis
Confocal microscopy and focus variation
Optical measurement method
Press fit pins
Company
Why Confovis?
News & Events
News
Events
Resources
Careers
Professionals & Graduates
Students
Open positions
Contact
Contact
Service & Support
Sales partners
Search:
Linkedin page opens in new window
Vimeo page opens in new window
Home
Products
AOI systems
WAFERinspect AOI
WAFERinspect AOI Dual
Multisensor Upgrade
Measurement systems
WAFERinspect
TOOLinspect
LEADinspect
Solutions
Advanced Packaging
Wafer Bump Inspection
MEMS
Semiconductors
AOI – Automated optical inspection
Compound semiconductors
Defect inspection & classification
Power semiconductors
RF – radio frequency technologies
Wafer inspection
Surface metrology
Roughness measurement
Lead analysis
Confocal microscopy and focus variation
Optical measurement method
Press fit pins
Company
Why Confovis?
News & Events
News
Events
Resources
Careers
Professionals & Graduates
Students
Open positions
Contact
Contact
Service & Support
Sales partners
Thank you for your inquiry
We received your message.
We will get back to you as soon as possible!
Home