Aktuelles

Confovis erhält ISO/IEC 27001:2022 Zertifizierung Wir freuen uns sehr, mitteilen zu können, dass Confovis erfolgreich nach ISO/IEC 27001:2022 zertifiziert wurde. In den vergangenen Monaten haben wir unsere internen Abläufe und Strukturen gezielt weiterentwickelt, um die Anforderungen dieser international anerkannten Norm zu erfüllen. Mit der erfolgreichen Zertifizierung haben wir einen wichtigen Meilenstein erreicht und bekräftigen unser…

Confovis introduces IR-SIM for non-destructive optical inspection of bonded wafer interfaces As advanced packaging technologies push the limits of semiconductor manufacturing, the need for non-destructive inspection methods inside bonded wafer stacks becomes more pressing than ever. Confovis now addresses this challenge by introducing IR-SIM — an infrared evolution of its Structured Illumination Microscopy (SIM) technology…

Inline wafer inspection and metrology for VCSEL manufacturing The laser diode market is growing fast thanks to applications such as facial recognition in entertainment electronics and LiDAR (light detection and ranging) in automotive applications. Fast and reliable inline quality control of VCSELs manufacturing VCSEL (vertical-cavity surface-emitting laser) is a type of semiconductor laser diode. Contrary…

LiDAR Inspection The semiconductor market linked to autonomous vehicles has more than doubled from 2015 to 2022 and it is expected to continue to grow over the next years representing one of the highest growth segments in the semiconductor industry.  Advanced driver assistance systems (ADAS) and fully autonomous vehicles require the automation of various aspects…