Confovis at the Trade Fair Control 2014
confovis presents solutions for the automotive, aerospace and semiconductor industries
confovis shows its measuring systems for fast quality inspection at the international ‘Control’ trade fair for quality assurance in Stuttgart. In addition to the new ConfoGate CGM-100 portal solution for standardized surface roughness measurement and the ConfoGate CGDR-100 twist portal for the automotive and ancillary industries, the CL300 3D measuring system for automated wafer analysis will also be presented. The Control trade fair takes place from 6 to 9 May 2014 in Stuttgart, and you can find confovis on Stand 7322 in Hall 7.
Enhanced image field
The new ConfoGate CGM-100 portal system has been designed for fast optical quality inspection in the automotive, aerospace, tool construction and mechanical engineering sectors. With this new system, the user has for the first time a measuring portal with an image field size of 2.5 x 2.0 mm, which with two image stacks carries out a precise microstructure analysis of up to 4.0 x 2.0 mm in 20 seconds. For a path length of for example 4 mm as demanded by DIN 4287 and DIN 4288, other systems currently available on the market require approx. 15 individual images – with an image field size of merely 0.45 x 0.33 mm. With the CGM-100, the time-consuming production and combination (stitching) of individual images is considerably reduced. The measurement results are available much faster than before, the fault analysis takes less time and the rejection rate is reduced.
The ConfoGate CGDR-100 twist portal enables contactless 3D surface analysis of rotationally symmetrical components such as drive shafts, crankshafts or camshafts in accordance with established standards. All twist parameters such as mobility, twist depth and angle, periodic length and supply cross-section can be determined in accordance with Daimler standard MBN 31007-07 and analysed using the corresponding software module. Rather than measuring point by point, the confovis twist portal scans an entire area, thus reducing the measuring time by up to 80 percent. With the ConfoGate CGDR-100, a high-performance measuring system is now available to the automotive and ancillary industries for quality assurance purposes.
Automated wafer analysis
For the semiconductor industry, confovis offers the CL300 3D measuring system for automatic inspection of wafers up to 300 mm. The CL300 is particularly suitable for characterisation of surface textures and determination of critical dimensions. As a confocal microscope with a magnification factor of 5 to 100 and a topological resolution down to 3 nm, the confovis CL300 provides both classic microscopy functions and enhanced 3D surface analyses. Automatic algorithms ensure that the measurements are reproducible and user-independent. Instead of measuring on a random-sample basis, all of the chips on the wafer can now be measured extremely quickly. The CL300 is already being successfully used within Fraunhofer IZM.