The Confovis WAFERinspect AOI system combines various inspection tasks on structured and unstructured wafers in a single system. By combining automated optical inspection (AOI) and metrology, Confovis AOI offers solutions for defect inspection and classification as well as 3D and 2D measurements (wafer level metrology) for MEMS, advanced packaging, RDL, bumps, etc..
The WAFERinspect AOI Dual is an AOI tool with two high-end sensors for semiconductor manufacturing inspection. The two sensors allow for a two-path approach inspection of wafers up to 300 mm. First, the whole wafer is scanned within minutes to determine a so-called safety map. Then every structure is analysed to nm accuracy with the ConfoCam module.
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