YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexible
- High level of automation
- AI-assisted 3D defect and anomaly detection
- Fast high resolution full wafer scan with a high numerical aperture
- Specially for lenses & bumps in LiDAR & Advanced Packaging
- Two high end sensors mounted next to each other on independent Z-axes
confovis · Products · AOI Systems ·
The WAFERinspect AOI Dual is an automated optical inspection (AOI) tool with two high-end sensors for semiconductor manufacturing inspection. The two sensors allow for a two-path approach inspection of wafers up to 300 mm. It is specifically designed for the inspection of lenses and bumps in LiDAR and advanced packaging applications. First, the whole wafer is scanned within minutes to identify defects. Then structure in question are analysed to nm accuracy with the ConfoCam module.
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More InformationThe WAFERinspect AOI Dual system can perform a full 3D scan of a 300 mm wafer within 2 to 3 minutes. This allows a fast 3D defect inspection. It is of particular interest for micro-lenses and bumps in LiDAR and Advanced Packaging for example.
The availability of the two adjacent sensors allows for a two-path approach:
Hence, in a second path, the structures in question can be analysed to single nm accuracy with the Confovis patented optical measurement method.
Structure heights ranging from 50 µm to few mm can be seamlessly measured with the 1200 points white light sensor can cope with it.
Whether it is deformations of micro-lenses for LiDAR or height distributions of bumps in advanced packaging, the AOI Dual system can carry out a 100% 3D defect inspection on big data up to 1 TB/wafer.
The artificial intelligence (AI) capability of Confovis in anomaly detection allows to detect unknown defects.
Additionally, a comparison between the actual shape of the structures and a target (golden sample) is possible.
WAFERInspect AOI Dual: Applications
- LiDAR
- Micro Lenses
- Advanced Packaging
- MEMS
- Micro LED
- Laser Diodes
- Bump Bonding
- FE Readout Chips
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
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Full 3D defect and anomaly inspection for inline semiconductor manufacturing
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Optical high-resolution image-based defect inspection on compound semiconductors
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- Full wafer high-speed scan: 100% at very high speed, e.g. for lenses or bumps. 300 mm wafer in 2-3 min with high resolution
- High-resolution scan with the confocal system (to reference the confocal measurements with the high-speed pre-scan measurements)
- Two high-end sensors mounted next to each other on two different Z-axes on top of the granite
- The 300 mm XY-stage is fully accessible to both sensors as it is mounted on an independent X-axis
- 5 axes in total
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