Advanced Packaging

confovisSolutionsAdvanced Packaging

Confovis Solutions - Advanced Packaging

Wafer Bump Inspection

The patented Confovis measurement process is the technology leader in the resolution of bumps (wafer bump inspection) and copper pillars (copper pillar inspection) from 2 µm to 100 µm. Not only height, but also shape and surface of the bumps (Wafer Bump Metrology) can be measured independently of the material.

 

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