Multisensor Upgrade

Versatility & flexibility for transparent wafers such as glass, GaN, SiC
Additional Precitec® optical Chrocodile sensors for multiple mesurement methods on a single tool
Speed and accuracy
AI-assisted inspection and metrology
User-friendly GUI

confovis ⋯ Products ⋯ AOI Systems ⋯ Multisensor Upgrade

At the core of the WAFERinspect AOI is the well-proven ConfoCam® scan head developed and patented by Confovis. The ConfoCam® scan head has 2 modes of operation, confocal and focus variation, allowing for resolutions close to those of AFM with scanning throughputs up to 1000 times faster.

The WAFERinspect AOI is a fully automated wafer inspection and metrology tool, configurable for a wide range of applications in the wafer foundry, using both standard and customized solutions.

Flexibility and versatility are key features when it comes to metrology for modern semiconductor foundries. The multisensor upgrade of the WAFERinspect AOI provides a modular approach to create a fully automated tool that can solve all the required measurement tasks. The ConfoCam® scan head 2-in-1 can be complemented with additional TTV, TSV and thin film sensors on the same Z axis.

The multisensor upgrades allow for the measurement of a wide variety of new products. Moreover, by using a hybrid metrology concept, it is possible to enhance the precision of measurements where a single sensor is not sufficient.

The measurement system of the WAFERinspect AOI is based on a granite stand. The whole surface of the 300mm XY stage on the granite is fully accessible to all the sensors in any of the configurations with one or two Z axes.

When it comes to automation, flexibility is key.

The robot handling unit can be configured for wafers up to 300 mm. It can be also configured for the handling of non-SEMI-standard wafers, such as highly warped wafers or thin wafers.

The EFEM features a dual arm robot with various end-effectors, two load ports including scanner and RFID reader, pre-aligner and, if needed, OCR (Optical Character Recognition) reader stations.

The WAFERinspect AOI is equipped with filter fan units (FFU) providing ISO class 3 clean room conditions within the tool.

The tool is run by the SEMI-compliant software. This software allows recipe-based measurement and data analysis of structured and unstructured wafers.

Suitable measurement and evaluation routines can be chosen for your measuring task from a variety of packages. For recurring structures, a layout wizard with a graphical user interface (GUI) can support the user in teaching the measuring positions. In addition, fine sample alignment via pattern recognition is available as an option.

This software provides comprehensive capabilities, from manual measurement on the tool to fully automated measurement with one-button operation and integration into production control systems, e.g. via a SECS/GEM interface.

Various measurement tasks using different sensors to run consecutively as a measurement sequence is easy to configure. This includes the execution of measurements, processing and analysis using intelligent algorithms, output and visualization of results in the form of reports and the export of results in various data formats.

ARE YOU LOOKING FOR A SOLUTION FOR YOUR APPLICATION?

METROLOGY UNIT

WAFER HANDLING UNIT

EFEM ENCLOSURE

SOFTWARE

For large wafers/substrates
(XY stage up to 350mm)

Fully SEMI standard compliant automated wafer level system
within an Equipment Front End Module (EFEM)

Wafer handling (all kinds of wafers)
1 to 4 load ports (2" casette to 300 mm FOUP)
All kinds of defect inspection
3D/2D metrology
multisensor, TTV, TSV, thin film
IR inspection

ARE YOU LOOKING FOR A SOLUTION FOR YOUR APPLICATION?

YOUR CONTACT PERSON

Frank Thielert
info@confovis.com

Tel: +49 3641 27 410 – 00

Multisensor Upgrade

Hybrid metrology

Handling capability of various substrate types

Powerful software for fully automated wafer metrology

Configure your multisensor WAFERinspect AOI

WAFERinspect AOI tools