YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexibel
- High level of automation
The patented Confovis measurement method is technology leader, where the resolution of bumps (wafer bump inspection) and copper pillars (copper pillar inspection) between 2 µm and 100 µm is concerned. Irrespective of the material involved, not only the height of the bumps but also their shape and surface can be measured (wafer bump metrology).
Based on this technology, the Confovis WAFERinspect AOI Tool has been extended by a high-speed chromatic-confocal line sensor. Customers therefore have the opportunity to completely inspect wafers and panels with millions of bumps in a very short time (wafer bump inspection). It is possible at any time to resort to the Confovis measurement result as gold standard, in order to algorithmically reduce the process-related edge effects of the chromatic-confocal inspection.
It is not required to calibrate the Confovis measurement – irrespective of the material involved and of the ambient surface. The patented structured illumination microscopy (SIM) will ensure an accuracy of < 9 nm @ 3 sigma in the case of structure heights of 4 µm.
A 100%-wafer bump inspection is unavoidable, in order to ensure the reliability rates required for stacked devices in the future. Apart from dimensional measurements, the AOI systems from Confovis offer a wide range of bump inspection and metrology solutions in this respect.
The inspection of bumps and copper pillars includes the detection of missing, bridged and deformed bumps. Another inspection category offered by our systems is the detection of surface defects (such as foreign particles) on a bumped wafer.
- Extremely high accuracy at top speed
- 100 % bump inspection
- General surface inspection
- Redistribution layer (RDL) metrology and inspection
- High-resolution CD measurement
- Layer thickness measurement
- Support of manufacturing automation by the SECS/GEM interface
- Advanced inspection and measuring equipment for defect inspection and dimensional measurements
- Classification of faults and suppression of pseudo-defects
- Advanced algorithms allowing automated inspections
- The unique and patented high-precision confocal sensor from Confovis
- Additional Precitec sensors for customer-specific jobs
CONFOVIS WHITEPAPER & CASE STUDIES
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Challenges for the optical inspection of glass & compound semiconductor wafers
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Full 3D defect and anomaly inspection for inline semiconductor manufacturing
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Optical high-resolution image-based defect inspection on compound semiconductors
DOWNLOAD CASE STUDY
- Macro defects
- Micro defects
- Particle inspection
- Golden Sample
- Defect detection with AI (deep learning, anomaly detection)
- Feature-based defect classification with neural network
- Independent of materials: silicon, epoxy, glass, chrome, resist, etc.
- Measurements of demanding surfaces without artifacts (no ‘bat wings)
- High speed: 60 confocal frames per second (250 mil. measuring points)
- Film Thickness / Layer Stack
- Topography
- Coplanarity
- Bumps
- Roughness
- Step Height
Critical Dimensions
- Line/Space
- VIAs
- Oblong holes
- Overlay
The Confovis WAFERinspect AOI tool combines various inspection jobs on bump inspection. By combining automated optical inspection (AOI) with metrology, Confovis AOI is able to offer solutions for the defect inspection and classification as well as 3D and 2D measurements (Wafer Level Metrology).
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