Discover a variety of free downloads and useful resources to help you gain deeper insights into our technologies and solutions. The downloads include detailed whitepapers and case studies that provide you with practical examples and in-depth information.
The quality of bonded wafers often comes down to what you can’t see: voids, delamination, and non-uniformities buried at the interface. The IR-SIM method combines through-silicon infrared penetration with optical sectioning to deliver non-destructive, quantitative 3D reconstruction of the full wafer stack at sub-micron precision.
Compound semiconductors are becoming increasingly important due to the growing demand for smaller, faster and more energy-efficient integrated circuits. This case study describes a novel solution to identify and classify defects and thus constantly monitor the processing of compound semiconductors.
We introduce the first semiconductor calibration standards with nanostructured circular chirps for analyzing the topography accuracy of optical inspection systems. The development was carried out according to PTB guidelines and enables the determination of the transfer function for AOI tools and 3D confocal microscopes.
In this white paper, we present the latest 3D inspection solutions for semiconductor manufacturing. The focus lies on automated optical inspection (AOI) to detect the smallest defects, AI-assisted defect detection to improve accuracy and efficiency, and the patented SIM process for high-precision inspection of microlenses and advanced packaging.
The optical inspection of wafers (glass and compound semiconductors) is our focus in this white paper. We analyze the complex challenges and present forward-looking solutions: from precise dark-field microscopy to intelligent AI-supported defect detection. Discover how structured illumination and focus variation increase efficiency and revolutionize quality in semiconductor production.
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