YOUR CONTACT PERSON
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
- Fast and with nanometer precision
- Flexibel
- High level of automation
Combined automated optical inspection and metrology for serial inspection and measuring tasks
WAFERinspect AOI
The Confovis WAFERinspect AOI system combines the most diverse inspection tasks involving structured and unstructured wafers in just one system. By combining automatic optical inspection (AOI) and metrology the Confovis WAFERinspect AOI offers individual solutions for defect inspection and classification as well as for 3D and 2D measurements (wafer level metrology) for MEMS, advanced packaging, RDL, bumps etc.
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ARE YOU LOOKING FOR A SOLUTION FOR YOUR APPLICATION?
CONTACT US!
Frank Thielert
info@confovis.com
Tel: +49 3641 27 410 – 00
The Wafer Inspect software from Confovis ensures simple handling for the user by combining easy with professional modes, thus offering a maximum of assessment flexibility by way of „geometry measurements“. Formulas can be created within less than five minutes. Defects will be detected and assessed with the fully integrated and adaptable software from our partner NeuroCheck.
Critical Dimensions