The Confovis WAFERinspect AOI system combines the most diverse inspection tasks involving structured and unstructured wafers in just one system. By combining automatic optical inspection (AOI) and metrology the Confovis WAFERinspect AOI offers individual solutions for defect inspection and classification as well as for 3D and 2D measurements (wafer level metrology) for MEMS, advanced packaging, RDL, bumps etc.
In the field of defect Inspection, the defects on the wafers will be detected and classified during the scanning by the golden sample method. The relevant classificator works feature-based as well as image-based by way of artificial intelligence and is trained by the user to determine the affiliation to the relevant class on the basis of the defect properties identified. Hence, this does not require any defect teaching before the actual scanning, since the system itself finds the deviations between the golden sample and the defect scan on its own.
3D and 2D measurements
The Wafer Inspect software from Confovis ensures simple handling for the user by combining easy with professional modes, thus offering a maximum of assessment flexibility by way of „geometry measurements“. Formulas can be created within less than five minutes. Defects will be detected and assessed with the fully integrated and adaptable software from our partner NeuroCheck.
WAFERinspect AOI applications
WAFERinspect AOI – measurement tasks
- Macro defects
- Micro defects
- Particle Inspection
- Golden Sample
- Neural networks for rule-based classification of defects
- Independent of materials (silicon, epoxy, glass, chrome, resist, etc.)
- Measurements of demanding surfaces without artifacts (no ‘bat wings’)
- High speed: 60 confocal frames per second (251 million measuring points per second)
- Oblong holes